Scientific Highlights

3D imaging using synchrotron radiation is a widely used tool that allows access to the inner structure of complex objects. An international and interdisciplinary consortium of scientists from the Swiss Light Source (PolLux and cSAXs), the Friedrich-Alexander-Universität Erlangen-Nürnberg, and the University of Cambridge developed the new 3D imaging technique of Soft X-ray Laminography (SoXL). SoXL allows for the investigation of thin and extended samples while taking advantage of the characteristic absorption contrast mechanisms in the soft X-ray range, providing 3D information with nm spatial resolution.

Ultra-fast operando X-ray diffraction experiments reveal the temporal evolution of low and high temperature phases and the formation of residual stresses during laser 3D printing of a Ti-6Al-4V alloy. The profound influence of the length of the laser-scanning vector  on the evolving microstructure is revealed and elucidated.  

Researchers of the Paul Scherrer Institut have previously generated 3-D images of a commercially available computer chip. This was achieved using a high-resolution tomography method. Now they extended their imaging approach to a so-called laminography geometry to remove the requirement of preparing isolated samples, also enabling imaging at various magnification. For ptychographic X-ray laminography (PyXL) a new instrument was developed and built, and new data reconstruction algorithms were implemented to align the projections and reconstruct a 3D dataset. The new capabilities were demonstrated by imaging a 16 nm FinFET integrated circuit at 18.9 nm 3D resolution at the Swiss Light Source. The results are reported in the latest edition of the journal Nature Electronics. The imaging technique is not limited to integrated circuits, but can be used for high-resolution 3D imaging of flat extended samples. Thus the researchers start now to exploit other areas of science ranging from biology to magnetism.