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Former Group Members
Former Group Members
SCCER-HaE
SCCER Storage aims to develop the science and technology of electricity & heat storage in order to guarantee the continuous (temporal and regional), reliable, and cost-efficient supply of power, heat, and fuels derived from intermittent renewable energies. In Phase II (2017-2020) it will continue to develop a better understanding of the boundary conditions under which energy storage technologies will be key components of the future Swiss energy system.
Peer Reviewed Publications (Scientific Articles and Books)
Kim, W., Burgherr, P., Spada, M., Lustenberger, P., Kalinina, A. and Hirschberg, S. (2019). Energy-related Severe Accident Database (ENSAD): cloud-based geospatial platform, Big Earth Data, doi:10.1080/20964471.2019.1586276
Selected Conference Contributions
Burgherr, P. (2018). Resilient Energy Infrastructures in the Context of Safety, Security and Sustainability (Invited Keynote Presentation), 3rd International Conference on Uncertainty in Mechanical Engineering (ICUME), Darmstadt, Germany
PhD, MSc and BSc Theses, Internships Reports
Cox, Brian (2018). Mobility and the Energy Transition: A Life Cycle Assessment of Swiss Passenger Transport Technologies including Developments until 2050., ETH Zurich, Vol. 25081 Lordan-Perret, Rebecca (2017). Essays in Energy Policy: The Interplay between Risks and Incentives., University of Chicago Hofer, Johannes (2014). Sustainability Assessment of Passenger Vehicles: Analysis of Past Trends and Future Impacts of Electric Powertrains., ETH Zurich, Vol. 22027
Technical Reports and Working Papers
Cox, B. and Bauer, C. (2018). The environmental burdens of passenger cars: today and tomorrow, Paul Scherrer Institut, Villigen PSI, Switzerland., pp. Link to BFE website Linden, D., Cinelli, M., Spada, M., Becker, W. and Burgherr, P. (2018). Composite Indicator Analysis and Optimization (CIAO) Tool., Link to the CIAO tool
3D imaging for planar samples with zooming
Researchers of the Paul Scherrer Institut have previously generated 3-D images of a commercially available computer chip. This was achieved using a high-resolution tomography method. Now they extended their imaging approach to a so-called laminography geometry to remove the requirement of preparing isolated samples, also enabling imaging at various magnification. For ptychographic X-ray laminography (PyXL) a new instrument was developed and built, and new data reconstruction algorithms were implemented to align the projections and reconstruct a 3D dataset. The new capabilities were demonstrated by imaging a 16 nm FinFET integrated circuit at 18.9 nm 3D resolution at the Swiss Light Source. The results are reported in the latest edition of the journal Nature Electronics. The imaging technique is not limited to integrated circuits, but can be used for high-resolution 3D imaging of flat extended samples. Thus the researchers start now to exploit other areas of science ranging from biology to magnetism.