
LTP: Laboratory for Particle Physics
Scientific Highlights and News
Search for Axionlike Dark Matter through Nuclear Spin Precession in Electric and Magnetic Fields
We report on a search for ultralow-mass axionlike dark matter by analyzing the ratio of the spin-precession frequencies of stored ultracold neutrons and 199Hg atoms for an axion-induced oscillating electric dipole moment of the neutron and an axion-wind spin-precession effect. No signal consistent with dark matter is observed for the axion mass range 10-24 ≤ ma ≤ 10-17eV.
Commissioning and first performance studies of the new CMS pixel detector
In the previous months the new CMS pixel detector was brought into operation. The detector was moved from PSI to CERN and installed in February, followed by an intensive period of commissioning and calibration. This process mostly involved the adjustment of many operational parameters which influence the detector performance, e.g.
Le travailleur de force du val Mesolcina
Aldo Antognini a la physique et la convivialité dans le sang. Aldo Antognini, chercheur au PSI, a reçu plus de 2 200 000 francs de l’UE pour sa nouvelle expérience. Son objectif: déterminer la répartition du magnétisme dans le proton. Pour y arriver, ce physicien des particules devra mettre ses talents scientifiques et techniques à contribution, mais aussi son entregent.
Comparison of ultracold neutron sources for fundamental physics measurements
Ultracold neutrons (UCNs) are key for precision studies of fundamental parameters of the neutron and in searches for new charge-parity-violating processes or exotic interactions beyond the Standard Model of particle physics. The most prominent example is the search for a permanent electric-dipole moment of the neutron (nEDM). We have performed an experimental comparison of the leading UCN sources currently operating.
High-resolution non-destructive three-dimensional imaging of integrated circuits
Modern nanoelectronics has advanced to a point at which it is impossible to image entire devices and their interconnections non- destructively because of their small feature sizes and the complex three-dimensional structures resulting from their integration on a chip. This metrology gap implies a lack of direct feedback between design and manufacturing processes, and hampers quality control during production, shipment and use.