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Installation of Heidelberg DWL66+
Heidelberg DWL66+ direct laser writer, funded by ANAXAM, is in operation now. It is a new photolithographic system closing the gap between the mask aligners on one side and the Nanoscribe two-photon 3D lithography system on the other. It is equipped with semiconductor laser with the wave length of 405 nm and is capable of exposing the minimum feature size down to 0.3 µm on wafers up to 200 mm or 9"x9" mask blanks.
Installation of SPTS Rapier Deep Reactive Ion Etcher
SPTS Rapier system for Si deep reactive ion etching (DRIE) is released for user operation. The system is acquired by PSI as a part of SNF R’Equip project “Advanced Si DRIE tool for highly uniform ultra-deep structuring (SiDRY)”. This versatile tool is equipped with pulsed bias option and sensitive ClaritasTM optical end point detection system. Electrostatic clamping and wafer edge protection systems are both available for three wafer diameters – 100 mm, 150 mm, and 200 mm.